dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• Just like tags for requirements, categories of your test cases can be invaluable for slicing and dicing your testing data so that you can determine what's really happening.
  就像对于需求的标签一样，测试用例的范畴对于切割测试数据以便决定到底发生了什么来说是无价的。
• Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized.
  通常情况下，剥离速度和切割速度都是很低的。基于其本身的能力来讲，激光器没有运行在最优化的状态下。
• Our process training would cover variety of topics from choosing the right blades to setting an appropriate dicing process for various materials and applications.
  我们的工艺培训可以涵盖不同的主题，包括面对不同材料和应用该如何选择合适的刀片到设置适当的工艺参数等。
• A lady doesn't crawl around on the decks dicing with the crew.
  高贵女士可不会和船员们在船的甲板上来回爬。
• After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
  通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
• Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.
  介绍了半导体行业的发展，晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。
• We are dicing for drinks. It's foolish to risk money on a throw of the dice.
  我们在掷骰子赌喝酒。掷骰子赌博，是很愚蠢的。
• The system functions mainly include macro dicing, micro planning and district demolition.
  该系统主要有学校宏观划片、微观规划和片区拆迁等功能。
• Performance analysis and three-dimensional modeling of wafer dicing with diamond blade
  金刚石砂轮刀片划切过程性能分析与三维建模
• Design and Implementation of Primary and Secondary Schools Admission Dicing System Based on Proximity Principle
  基于就近原则的中小学招生划片系统设计与实现